Senior Power Electronics Packaging Specialist

vor 2 Wochen

Munich, Bayern, Deutschland Li Auto Vollzeit

About Li Auto: We are a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Our mission is to provide families with safer, more comfortable, and more convenient products and services through innovative technologies and business models.

The Role:
We are seeking a Senior Power Electronics Packaging Specialist to join our power module team. As a pioneer in the field of automotive-grade SiC device packaging and application, we are looking for an experienced professional who can lead the development of advanced power module processes and contribute to our team's groundbreaking work.

Responsibilities:

  • Track and analyze the latest SiC power module technology trends to define our power module process technology roadmap.
  • Lead a team to complete pre-research on advanced process technologies and collaborate with universities and research institutes on technical cooperation.
  • Develop advanced power module processes and output process files.
  • Support the product development team in completing product development and importing products to factory for mass production.
  • Solve major process issues, improve reliability and yield in collaboration with mass production process teams.

Requirements:
  • Bachelor's degree or above in microelectronics, materials engineering, power electronics, mechanical electronics, or related fields.
  • More than 8 years of experience in power semiconductor packaging product development or technology research and development.
  • Prior industry-leading product development and mass production experience is preferred.
  • Proficient in packaging system design, thermal design, electrical design, and reliability design, with industry-leading expertise in one aspect.
  • Successful experience in SiC module development, especially in achieving mass production status.
  • Familiarity with the overall situation of the semiconductor packaging industry and strong interpersonal relationships within the industry.
  • Profound knowledge of key packaging processes and corresponding equipment, such as Die Attach, Wire Bonding, Silver/Copper Sintering, Solder Reflow, Molding, or Potting.

Salary: The estimated salary range for this position is $120,000 - $180,000 per year, based on industry standards and location considerations.

Contact Information: If you are passionate about pioneering work in the power semiconductor field and have the required skills and qualifications, please submit your application for consideration.

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