Senior Power Electronics Engineer for SiC Module Development
Vor 2 Tagen
We are a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Our power module team is one of the leading teams in the power semiconductor industry, known for its exceptional capabilities and expertise in the power semiconductor field.
About the RoleAs a Senior Power Electronics Engineer for SiC Module Development, you will be responsible for designing and developing advanced SiC power modules. Your primary focus will be on electrical design, simulation, and verification of power module packaging. You will work closely with our team to complete pre-research on advanced packaging solutions and organize technical cooperation with universities and research institutes.
Responsibilities- Track industry technology trends and define electrical design technology roadmaps for SiC power modules
- Cooperate with the team to complete pre-research on advanced packaging solutions (electrical design aspect) and organize technical cooperation with universities and research institutes
- Responsible for SiC power module electrical design, simulation, and verification of power module packaging
- Develop advanced electrical design techniques with strong competitiveness in the industry
- Solve difficult problems of power modules, such as oscillation, current sharing, system coupling, and module reliability
- Investigate and dynamically track forward-looking technology of power semiconductor packaging (electrical design aspect)
- Develop sic MOSFET chip simulation models, complete simulations and verifications of dynamic characteristics of the chip model
- Responsible for power chip selection, develop chip requirements, screen chips, and implement optimal patch strategies, and finally introduce new chips into batch production and verification
- Masters degree or above in microelectronics, power electronics, electrical engineering, mechanical electronics, or other related majors
- More than 8 years of experience in electrical development or technology research and development of power semiconductor packaging
- Familiar with the overall situation of the semiconductor packaging industry and have good interpersonal relationships in the industry
- Possess a solid theoretical foundation for the microstructure, basic working principles, common failure modes, and power electronic circuits of power semiconductor devices such as Si, SiC, and GaN
- Proficient in electromagnetic fields, circuits, power electronics, and basic principles of power devices
- Master SiC power module electrical design tools (such as Q3D, Pspice, Siwave, etc.)
- Excellent negotiation and problem-solving skills
- Self-motivated & learning
- Proactive and creative
- Excellent time management and ability to work under pressure
- Self-confidence
- Self-motivated and goal-driven
- Oriented toward results
- Good command of English written and oral communication skills
Salary: $120,000 - $180,000 per year (dependent on experience), benefits include comprehensive health insurance, retirement plans, and generous paid time off.
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