Systems Architect
vor 12 Stunden
**About Quantum Brilliance**
Quantum Brilliance is the world leader in room-temperature quantum computing using synthetic diamonds. Our unique vision is to make quantum computing available as an everyday technology, from data centres to remote and mobile systems like autonomous robots and satellites. In contrast to quantum computers that fill a room, we are developing quantum accelerators with more compute power than a classical supercomputer but in a form factor smaller than a lunchbox.
**Role overview**
**Key responsibilities**
- Architect and define a SiP module for high-performance diamond-based quantum compute systems, integrating quantum and classical processors, quantum control electronics, photonic circuits, DACs/ADCs, sensors, interconnects, and thermal management components.
- Translate quantum system-level requirements into SiP-level specifications (functional, electrical, and thermal).
- Collaborate closely with quantum engineers, RF/microwave engineers, IC and control electronics designers, and packaging engineers to co-optimize the integration stack.
- Evaluate and select heterogeneous integration strategies including chiplets, 2.5D/3D packaging, advanced substrates, and interposers suitable for quantum-classical co-integration.
- Lead risk assessment, prototyping, and performance validation efforts for SiP modules, working closely with internal and external fabrication and assembly partners.
- Deliver a holistic approach to define a balanced package architecture that meets both system-level performance goals and packaging constraints.
- Lead and mentor a team of engineers and researchers involved in the design, simulation, and development of the SiP module.
- Develop and maintain technical documentation, system block diagrams, and verification plans.
**Required qualifications**
- PhD or Master's degree in Electrical Engineering, Applied Physics, Computer Engineering or a related discipline.
- Proven experience (typically 5+ years for Master's, 2+ years for PhD) in system architecture and integration of complex electronic systems.
- Proven experience in SiP or multi-chip module design, including successful tape-outs and transition to manufacturing.
- Strong background in heterogeneous integration, co-design across PCB/package/IC boundaries, and system-level simulation (electrical, thermal, SI/PI).
- Proficient with EDA/CAD tools and multi-physics simulation platforms.
- Familiarity with quantum computing hardware architectures, particularly control stack requirements (microwave/RF, digital-to-analog conversion, feedback systems) is a plus.
- Demonstrated leadership experience in cross-functional engineering projects.
- Excellent problem-solving, communication, and collaboration skills
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