Technician I-Production

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B) global organization? We offer all that and more at Microchip Technology Inc.People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our ; we affectionately refer to it as the and it’s won us countless awards for diversity and workplace excellence.Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over without a great team dedicated to empowering innovation. People like you.Visit our page to see what exciting opportunities and company awaitJob Description:The Teltow location designs and manufactures electronic components, mainly based on Surface Acoustic Wave (SAW) technology. Most products are customer specific. Our site includes production areas with different clean room classes for the frontend (wafer manufacturing) and backend (assembly) areas. Reporting to the Production Manager, you will be part of the backend production team responsible for setting up machines in our SAW production line.What’s attractive about this opportunity?This position will expose you to a wide variety challenges related to backend manufacturing technologies for Surface Acoustic Wave filters and oscillators.More details on the expectations and responsibilities in this position:Wire-bondingDie-bondingFinetuningLid-PlacementFlip chip bondingWork with work instructions and inspection requirements in accordance with documented processesWillingness and ability to collaborate with other relevant departments to ensure high productivityRequirements/Qualifications:Completed technical training, technician or higher qualificationUnderstanding for technical relationshipsFine motoric hand work under microscopeMicrosoft office knowledges CompetenciesGood technical and electronical understanding to support the manufacturing equipment.Interdepartmental teamworkHigh reliabilityGood German language skills are requiredTravel Time:No TravelTo all recruitment agencies: