Substrate Cutting Expert

vor 3 Wochen


Munich, Bayern, Deutschland Bertrandt Vollzeit
Job Description

We are seeking a highly skilled Substrate Cutting Expert to join our team at Bertrandt. As a key member of our team, you will be responsible for the development and execution of projects in the field of cutting and polishing SiC substrates.

Key Responsibilities:
  • Lead the manufacturing processes for SiC power components related to substrate cutting and polishing modules, ensuring timely solutions to quality issues and smooth operations during the ramp-up, pre-production, and production phases.
  • Monitor and track engineering processes, as well as derive appropriate corrective actions, analyzing and summarizing process data from engineering batches and addressing relevant technical issues.
  • Become an expert in product reliability requirements, testing methods, and evaluations.
  • Focus on increasing productivity and tackling major challenges.
Requirements:
  • Successfully completed studies in semiconductor physics, microelectronics, materials science, chemistry, or a comparable field within the semiconductor industry.
  • At least 10 years of experience in the introduction or development of processes for cutting and polishing semiconductor substrates.
  • Practical experience in the introduction or production of SiC products in fabs is required.
  • Proficiency in measurement methods and techniques for evaluating materials and process results.
  • Ideal experience in the mass production of semiconductor technology.
  • Hands-on mentality and open attitude towards intercultural work environments.
  • Excellent communication and presentation skills in English, knowledge of German and/or Chinese is also advantageous.
What We Offer:
  • Responsible tasks
  • Flexible working hours
  • Networking throughout the group
  • Attractive compensation
  • Team-oriented work


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