Substrate Cutting Expert

vor 1 Monat


Munich, Bayern, Deutschland Bertrandt Vollzeit
Job Title: Expert in Substrate Cutting

We are seeking an experienced professional to join our team as an Expert in Substrate Cutting. In this role, you will be responsible for the development and execution of projects related to cutting and polishing SiC substrates.

Key Responsibilities:
  • Lead the manufacturing processes for SiC power components related to substrate cutting and polishing modules.
  • Ensure timely solutions to quality issues and smooth operations during the ramp-up, pre-production, and production phases.
  • Monitor and track engineering processes, and derive appropriate corrective actions.
  • Analyze and summarize process data from engineering batches and address relevant technical issues.
  • Become an expert in product reliability requirements, testing methods, and evaluations.
  • Focus on increasing productivity and tackling major challenges.
Requirements:
  • Completed studies in semiconductor physics, microelectronics, materials science, chemistry, or a comparable field within the semiconductor industry.
  • At least 10 years of experience in the introduction or development of processes for cutting and polishing semiconductor substrates.
  • Practical experience in the introduction or production of SiC products in fabs is required.
  • Proficiency in measurement methods and techniques for evaluating materials and process results.
  • Extensive expertise in semiconductor material processing, preferably in the development of power components.
  • Experience in the mass production of semiconductor technology is advantageous.
  • Hands-on mentality and open attitude towards intercultural work environments.
  • Excellent communication and presentation skills in English, knowledge of German and/or Chinese is also advantageous.
What We Offer:
  • Responsible tasks
  • Flexible working hours
  • Networking throughout the group
  • Attractive compensation
  • Team-oriented work


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