Senior IC Package Design Engineer

Description

Join our Team

About this opportunity
Are you passionate about driving innovation and working on cutting edge 5G and 6G mobile communication solutions? Do you thrive in a flexible working culture, where new ideas are fostered, and you are encouraged to develop new skills? 
Then join Ericsson and our growing team in Rosenheim, Germany, as a senior expert for electronic packaging assembly We are working on all horizons: from the device technology to the package implementation, from novel designs and architectures to the end module prototype. The Device can cover all applicable power levels and frequency bands used for future mobile narrow band and broadband applications.

What you will do:
• Be part of a diverse and multi-functional team that is enthusiastic, to advance the state of the art in the area of highly integrated Multi Chip Digital IC packages
• Define and set up a common Package Design flow using industry standard EDA tool platform, including the relevant design documentation
• Interface and coordinate with multi-functional groups throughout Ericsson organization on product pre-development activities (Package/SiP/module feasibility analysis, design and selection, package pin out optimization, Chip floorplan and bump placement optimization)
• Promote Chip-Package-PCB Co-Design philosophy within the Engineering community
• Collaborate with external partners (OSATs) on design optimization, design reviews and ensure that Design for Manufacturing requirements are met
• Define and align package substrate stack-ups with Ericsson design teams and external partners/suppliers, considering technical and cost aspects
• Set up and maintain Product Design Kit (PDK) / Assembly Design Kit (ADK) libraries to ensure smooth Design Rule / Design for Manufacturing Checking
 

The skills you bring :
• A Bachelor, Master or University Degree in Engineering preferably with an emphasis on Electrical engineering / Electronics
• Solid experience within semiconductor packaging and test domain area are particularly advantageous
• Full proficiency in English, both written and spoken
• Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or similar EDA platform (Mentor Xpedition, Zuken CR-8000)
• Familiarity with various advanced package configurations and assembly/ substrate technologies (Flip Chip-BGA, Flip Chip-CSP, Multi-Chip Modules, High Density Fan-Out, etc.)
• Thorough understanding of Chip-Package-PCB Co-Design approach 
• Proven understanding of high-speed interfaces, such as DDR/HBM, UCIe, XSR, etc.
• Solid understanding in some SI/PI tools (HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model
• Basic knowledge of substrate manufacturing process, structure, design rules and material properties
• Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance)
• Ability of running engineering projects independently, practice systematic project / task management

Why join Ericsson?

At Ericsson, you´ll have an outstanding opportunity. The chance to use your skills and imagination to push the boundaries of what´s possible. To build solutions never seen before to some of the world’s toughest problems. You´ll be challenged, but you won’t be alone. You´ll be joining a team of diverse innovators, all driven to go beyond the status quo to craft what comes next.