Senior Failure Analysis Engineer

Senior Failure Analysis Engineer – Electronics Anker Innovations Bremerhaven, Germany
· Full-time
· On-site

About the Role
We're looking for a Senior Failure Analysis Engineer – Electronics to manage failure analysis of returned electronic and electrical products (RMA) across our global portfolio. You'll perform board-, circuit-, and component-level analysis to identify root causes of complex hardware failures — and help build our AI-enabled diagnostic capabilities.

What You'll Do
Failure Analysis & Root Cause Own RMA failure analysis from diagnosis through root-cause identification and closure. Perform board-, circuit-, and component-level troubleshooting using functional testing, signal/waveform analysis, and electrical characterization. Diagnose failures in power architectures (Buck/Boost, LDOs, PMUs, SoCs, charging ICs) and communication interfaces (I2C, SPI, I2S, PCIe, UART, CAN). Use oscilloscopes, multimeters, electronic loads, logic analyzers, X-ray, and thermal imaging to identify electrical, soldering, EMC, ESD, and component failures. Apply structured root-cause methods (8D, 5 Whys, FTA, Fishbone, DOE) and recommend corrective actions. Cross-Functional Collaboration Partner with R&D, Quality, Manufacturing, and Supplier Quality globally to drive corrective and preventive actions. Communicate complex failure mechanisms clearly in recurring technical reviews. Documentation & AI Enablement Produce standardized English failure analysis reports; build failure case libraries and troubleshooting guidelines. Support AI-enabled diagnostic tools by translating failure expertise into structured rules. What You Bring Required Bachelor's in Electrical/Electronics/Microelectronics Engineering (Master's preferred). 8+ years in electronics/hardware failure analysis, product quality, or sustaining engineering. Strong knowledge of PCBA design, components, circuit behavior, and electronic failure mechanisms. Hands-on experience with oscilloscopes, multimeters, electronic loads, logic analyzers, X-ray, and thermal imaging. Experience with power/functional modules (PMUs, SoCs, charging ICs, Buck/Boost, LDOs) and protocols (I2C, SPI, I2S, PCIe, UART, CAN). Experience writing 8D reports and managing CAPA to closure. Strong English technical writing; ability to collaborate across global teams. Mandarin Chinese proficiency required — close collaboration with R&D and Quality teams in China. Preferred Failure analysis experience in consumer electronics, IoT, robotics, or high-volume products. Experience applying AI/ML or knowledge systems to engineering workflows. Cross-functional leadership or mentoring experience.