Technical Lead

vor 1 Woche


Freiburg, Baden-Württemberg, Deutschland Quantum Brilliance Vollzeit 120.000 € - 180.000 € pro Jahr

About Us

Quantum Brilliance is the world leader in room temperature, miniaturised and ruggedised quantum technologies that can be deployed anywhere, and close to where you need it most. Central to our core offering is the integrated diamond quantum chip, which leverages the unique properties of NV centers in diamonds to be used for both quantum sensing and quantum computing applications, from data centres through to on-premises and edge applications such as autonomous vehicles, robotics, hospitals and aerospace.

Founded in 2019 by leading experts in diamond quantum science from the Australian National University, we are a full-stack quantum technology company. Headquartered in Sydney Australia, we have labs located in Australia (Canberra & Melbourne) and Germany (Stuttgart & Freiburg) and recently opened and office in Tokyo, Japan. We are partnering with universities, cutting edge materials and semiconductor companies, and exploring real world applications with HPCs, research institutes as well as industrial companies such as in automotive, telecommunications, aerospace and healthcare. We are back by large sovereign wealth funds from Australia as well as global deep tech VCs who are supporting us through this rapidly emerging market.

Location

This is a German based role which operate in a hybrid capacity in or near our Freiburg or Stuttgart Labs.

The Mission

As a Technical Lead - Integrated Quantum Sensor Architecture, you will lead the definition, design, and development of next-generation of diamond NV based Sensor architectures across multiple technology domains, including analogue/mixed-signal, RF, photonic ICs. You will work closely with multidisciplinary teams to define system-level specifications, explore innovative topologies, and translate product requirements into scalable solutions for diamond NV based quantum sensing products in different applications.

Key Responsibilities

  • Define and develop integrated sensing device architecture roadmaps aligned with QB's technology and product strategy.
  • Lead the design and integration of complex SoCs, SiPs, or ASICs needed for quantum sensing.
  • Collaborate with analogue, digital, RF, photonic, packaging, and firmware teams to drive design convergence.
  • Lead architecture-level modelling, simulation, and performance trade-off analysis.
  • Guide design partitioning, technology node selection, and packaging decisions (e.g., 2.5D/3D IC, chiplets).
  • Lead technical reviews, design documentation, and cross-functional alignment.
  • Responsible for IP selection, re-use strategy, and driving external foundry/vendor/partnership engagement for SiP solutions.
  • Mentor engineers and contribute to a culture of innovation and technical excellence.

Required Qualifications

  • Master's or Ph.D. in Electrical Engineering, Microelectronics, Physics, or related field.
  • 10+ years of experience in device architecture, ASIC/SoC design, or chip system integration.
  • Deep expertise in one or more areas: RF design, mixed-signal design, digital SoC, MEMS, photonics, advanced packaging and/or integrated sensor systems.
  • Strong understanding of semiconductor design flows, EDA tools, and simulation platforms (e.g., Cadence, Synopsys, Keysight).
  • Experience in high-level architectural trade-off analysis and modelling (e.g., MATLAB, Python, System Verilog, Ansys).
  • Familiarity with advanced semiconductor process technologies (e.g., FinFET, FD-SOI, GaN, SiGe, Silicon nitride PIC etc.).
  • Experience working with foundries, IP vendors, and external design partners.

Preferred/ Desirable Qualifications

  • Experience in system-in-package (SiP), hybrid photonic integration, heterogeneous integration of crystals or other materials.
  • Background in quantum technologies (e.g., quantum sensing, quantum computing, or quantum control).
  • Familiarity with sensors or low power edge devices is a strong plus.
  • Previous involvement in tape-outs and full-chip productization is an advantage
  • Knowledge of reliability, test strategy, and DFT/DFM considerations.
  • Knowledge of advanced sensor technology used in various applications and domains e.g defense aerospace, space, maritime and underwater.

Disclaimer: We advise that we do not wish to be contacted by recruitment agencies, unsolicited emails/resumes will not be accepted. Our hiring process is managed in-house and the best way for candidates to express interest in Quantum Brilliance is by applying with your resume/cover letter via our current openings.



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