Senior Photonics Packaging Engineer

Your Mission

The future of AI computing is light, not electrons. Q.ANT is building photonic processing systems that compute with light, delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.

As
Senior Photonics Packaging Engineer (f/m/d)
, you will lead the specification, development, and verification of high-density photonic packaging solutions that integrate photonic integrated circuits (PICs), light sources, photodetectors, and analog circuitry into production-ready modules. You'll be the technical authority ensuring that supplier-delivered modules meet stringent optical, electrical, thermal, and mechanical requirements through precise definition of technical requirements, contractual agreements, and supplier project management.

What You Will Do:

• Lead cross-functional coordination
  across R&D, system engineering, manufacturing, and test teams to align packaging solutions with product architecture
• Act as primary interface
  for suppliers, managing technical goals, schedules, deliverables, contracts, and negotiations
• Define complete packaging requirements
  including optical coupling techniques, thermal management, RF signal integrity, and hermetic sealing methods
• Plan and oversee multi-party R&D projects
  , tracking milestones, budgets, and risks
• Ensure supplier quality ratings
  maintain ≥95% on-time delivery with zero critical defects and packaging costs within ±5% of targets

What You Bring

• 5+ years of experience
  in
  hybrid packaging, photonics assembly
  , or
  optoelectronic integration
• Hands-on experience
  with
  PICs
  ,
  laser sources
  ,
  photodetectors
  ,
  analog electronics
  , and
  mixed-signal integration
• Deep expertise
  in
  optical coupling techniques
  ,
  thermal management
  for high-power photonic devices,
  RF module design and signal integrity
  , as well as
  packaging materials
• Proven track record
  managing supplier-led R&D projects
  from requirements through integration
• Strong leadership, negotiation, and systems thinking
  skills
• Master's or PhD
  in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related field
• Fluent in English
  ; German beneficial

What We Offer

• Make impact at scale:
  Help solve one of computing's biggest challenges—making growing demand in compute and sustainability go hand in hand
• Work on the leading edge:
  Photonic AI acceleration technologies that will define the next decade of computing - already validated in production HPC environments
• Own your work from day one:
  Broad autonomy and decision authority with direct impact on product success and the future of AI infrastructure
• Fast-track your growth:
  Work on challenges with few industry precedents—every problem you solve becomes new institutional knowledge and potentially industry-defining IP
• World-class team:
  Collaborate alongside a passionate, international, cross-functional team of experts in photonics, processor design, and AI systems
• Direct access to leadership:
  Work closely with the company's founders, including CEO Dr. Michael Förtsch, and advisory board members who shaped the semiconductor industry (ARM, Intel, Infineon)
• Collaborative culture:
  Innovative work environment that values technical excellence, open communication, and pragmatic problem-solving
• Be part of history:
  Join at the inflection point where photonic computing transitions from research to mainstream—your contributions will shape this transformation

We're looking for a technical leader who gets energized by developing novel photonic packaging solutions, managing supplier partnerships, and driving innovations that enable production systems already transforming AI computing.

Ready to define the packaging standards for photonic AI processors?

We are looking forward to receiving your application

Q.ANT is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.