Student Assistant

The Fraunhofer Institute for Reliability and Microintegration, IZM, is one of the world's leading institutes for electronic packaging and system-integration technologies as well as for applied research and development of robust and reliable electronic components, modules and systems.

We are looking for a student assistant to support this team.

**What you will do**
- Electromagnetic modeling, simulation and layout of selected electronic packaging structures
- High-frequency measurement of packaging structures and documentation of results

**What you bring to the table**
- Interest in high frequency/microwave engineering
- Willingness to learn, flexibility and a solution-orientated way of working
- Independent and structured working method
- Ability to work in a team and strong communication skills
- Good knowledge of German and/or English language

**What you can expect**
- Introduction to electromagnetic modeling, simulation, layout and measurement of electronic packaging structures
- Continuation of activities as part of a Bachelor's/Master's thesis
- Flexible design options to suit the study plan
- Open and collegial working environment
- State-of-the-art laboratory equipment and software tools for high-frequency design, test and characterization up to 500 GHz
- Opportunity to participate in cutting-edge research and development projects with national and international partners

With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future.

Fraunhofer Institute for Reliability and Microintegration IZM

Requisition Number: 72145