Senior Photonics Packaging Engineer

Your missionThe future of AI computing is light, not electrons. Q.ANT is building photonic processing systems that compute with light – delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.As Senior Photonics Packaging Engineer (f/m/d), you will lead the specification, development, and verification of high-density photonic packaging solutions that integrate photonic integrated circuits (PICs), light sources, photodetectors, and analog circuitry into production-ready modules. You'll be the technical authority ensuring that supplier-delivered modules meet stringent optical, electrical, thermal, and mechanical requirements through precise definition of technical requirements, contractual agreements, and supplier project management.What makes this role unique:High complexity: Developing novel high-density photonic packaging concepts that simultaneously address thermal management, optical alignment, RF signal integrity, and manufacturability – an area with few industry precedentsStrategic freedom: Broad autonomy to define requirements, select suppliers, and design technical strategies within strategic goals and budgetary limitsDecision authority: Direct influence on supplier relationships, product architecture decisions, and program economics innovation mandate: Implementation of at least one new packaging material, process, or architecture annually that becomes differentiating IP for the companyReal-world impact: Your work directly enables technology already deployed in production at world-leading institutions like the Leibniz Supercomputing CentreWithin your first 18-24 months, you will:Achieve leading-edge integration density and performance through innovative packaging architectures that enable our photonic processors to deliver up to 30x energy efficiency vs. conventional systemsMinimize integration risks and rework through rigorous supplier verification and quality assuranceContribute to competitive advantage by accelerating time-to-market and optimizing cost-performance trade-offs in the rapidly scaling photonic computing market Key responsibilities:Cross-functional leadership: Coordinate internal R&D, system engineering, manufacturing, and test teams to align packaging solutions with overall product architectureSupplier engagement & interface role: Act as the primary point of contact for suppliers, ensuring alignment on technical goals, schedules, and deliverables, including contract management and negotiationProject control: Plan and oversee multi-party R&D projects, tracking milestones, budgets, and risks, while ensuring deliverables are verified and integrated into final systemsTechnical specification: Define complete packaging requirements, including optical coupling techniques, thermal management strategies, RF signal integrity, and hermetic sealing methodsQuality assurance: Ensure supplier quality ratings maintain ≥95% on-time delivery with zero critical defects, and packaging costs remain within ±5% of budgeted targetsYour profileEducation & Experience:More than 5 years of experience in hybrid packaging, photonics assembly, optoelectronic integration, or related high-density interconnect technologiesProven track record in managing supplier-led R&D and packaging projects, from requirements definition through to integration and validationHands-on experience with PICs, laser sources, photodetectors, analog electronics, and mixed-signal integrationMaster's or PhD in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related fieldDeep Technical Expertise in:Optical coupling techniques (butt-coupling, lens coupling, fiber array integration)Thermal management strategies for high-power photonic devicesUnderstanding and enhancement of RF signal integrity for highest performance in different high density interconnectsPackaging material science (polymers, ceramics, metals) and hermetic sealing methodsRelevant standards for reliability and environmental testing (e.g., Telcordia, JEDEC)Tools & Processes:Familiarity with CAD tools for photonics/electronics packaging, optical simulation software, and statistical process controlLeadership & Coordination Skills:Exceptional ability to lead cross-functional teams across R&D, system engineering, manufacturing, and test domainsSkilled in negotiation and contract management with external suppliers and R&D partnersStrong systems thinking to balance optical, electrical, thermal, and mechanical requirements simultaneouslyExcellent communication skills with the ability to translate complex technical trade-offs to management and stakeholdersLanguages:Fluent in English; German or other European language beneficialPreferred Qualifications:Experience with photonic integrated circuit (PIC) packaging for AI or HPC applicationsKnowledge of high-speed digital interfaces and their integration with photonic systemsFamiliarity with scaling systems from prototype to volume productionUnderstanding of supply chain management and material supplier ecosystems in photonicsWhy us?Make impact at scale: Help solve one of computing's biggest challenges—making growing demand in compute and sustainability go hand in handWork on the leading edge: Photonic AI acceleration technologies that will define the next decade of computing - already validated in production HPC environmentsOwn your work from day one: Broad autonomy and decision authority with direct impact on product success and the future of AI infrastructureFast-track your growth: Work on challenges with few industry precedents—every problem you solve becomes new institutional knowledge and potentially industry-defining IPWorld-class team: Collaborate alongside a passionate, international, cross-functional team of experts in photonics, processor design, and AI systemsDirect access to leadership: Work closely with the company's founders, including CEO Dr. Michael Förtsch, and advisory board members who shaped the semiconductor industry (ARM, Intel, Infineon)Collaborative culture: Innovative work environment that values technical excellence, open communication, and pragmatic problem-solvingBe part of history: Join at the inflection point where photonic computing transitions from research to mainstream—your contributions will shape this transformationWhy Q.ANTWork on photonic AI acceleration technologies already deployed in a production HPC environmentHelp solve one of computing’s biggest challenges: scaling AI compute while keeping power and sustainability in balanceHigh autonomy and decision authority – your architecture decisions directly shape how photonic processors operate and become company IPDeep-tech scale-up with strong funding and an international team combining photonics, processor and AI systems expertise We're looking for someone who gets energized by the challenge of integrating cutting-edge photonics with high-speed digital systems - and who wants to see their work deployed in production systems that are already changing how the world computes.Ready to architect the future of AI computing?We are looking forward to receiving your application Q.ANT is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.About usWho we are and what we doQ.ANT is a photonic deep-tech scale-up developing photonic processing solutions that compute natively with light and deliver a scalable alternative to transistor-based systems. Its Light Empowered Native Arithmetics (LENA) architecture delivers analog co-processing power optimised for complex computation and enabling energy-efficient performance for next-generation AI and HPC applications. Q.ANT operates its own Thin-Film Lithium Niobate (TFLN) chip pilot line in collaboration with the Institute for Microelectronics Stuttgart, IMS CHIPS, and is currently shipping its Native Processing Servers to selected partners. Q.ANT was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart, Germany.