Senior Equipment Hook-Up Engineer

About usEuropean Semiconductor Manufacturing Company (ESMC) is a joint venture between four technology leaders, TSMC, Bosch, Infineon and NXP, to establish a state-of-the-art semiconductor fab in the heart of Europe. ESMC represents our shared commitment to strengthening the European semiconductor ecosystem.To help us build the foundation of our future fab in Dresden, we are looking for a highly motivated and passionate:Senior Equipment Hook-Up EngineerAs a Senior Equipment Hook-Up Engineer, you will be coordinating all hook-up activities from planning, construction, and commissioning of faculty media supplies (gases, chemicals, exhaust air, ultra-pure water, wastewater, electricity) from the base build supply connection to the process equipment at our new state-of-the-art semiconductor fab in Dresden. Your role will ensure system safety, reliability, efficiency, and compliance while driving continuous improvement and innovation. You will collaborate with internal teams and external service providers.Key ResponsibilitiesNew challenges: Become part of the facility team to build ESMC's 300mm semiconductor fabSystem Ownership & Optimization: Develop and manage detailed schedules for equipment hookups, coordinating with equipment vendors, construction teams, contract vendor management, and facility engineers to ensure seamless integration in compliance with environmental and safety regulationsTechnical Expertise: Review and approve hookup designs and engineering plans, ensuring compliance with industry standards and project specifications. Experience in electrical, process colling water, ultra-pure water, Gas & Chemical, and other Plastic utility systemsData-Driven Decision Making: Monitor and report on the progress of hookup activities to senior management, addressing any issues or delays proactivelyProject Involvement: Support system design, construction, and commissioning for new facility installations and upgradesContinuous Improvement & Cost Optimization: Plan, coordinate, and execute strategies to accelerate hookup progress. Identify opportunities for cost savings, reliability improvements, and integration of best practicesCollaboration: Lead a team of technicians and contractors, providing guidance, training, and performance evaluations. Communicate with cross function engineers or vendersQualifications and EducationDegree in Electrical, Chemical, Mechanical or Automation Engineering or a related fieldMust have experience10+ years of experience in equipment hookup or facility engineering within the semiconductor industryProven track record in managing large-scale construction or installation projectsFamiliarity with semiconductor fabrication processes and equipmentLanguage SkillsFluent German and English language skillsProfessional SkillsProficient with Microsoft Office, discipline-specific software (i.e., AutoCAD, Revit, etc.)Personal AttributesStrong analytical thinking and highly effective interpersonal and communication skills when interacting with othersLocation: Dresden, Germany.What we offerEach journey starts with a first step. Joining ESMC at this early stage will provide you with the unique opportunity to actively shape the future of the fab in Dresden, boost your career and unlock your potential. Work in a fast paced, international startup environment while at the same time having access to the experience, talent, and resources of the largest and most advanced semiconductor manufacturer in the world, TSMC.At ESMC, we create an inclusive environment to inspire passion and enable the best in YOU. It is the policy of ESMC to provide equal employment opportunity (EEO) to all persons regardless of age, color, ethnic and national origin, citizenship status, physical or mental disability, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, genetic information, marital status, status with regard to public assistance, veteran status, or any other characteristic protected by federal, state or local law.ContactPlease apply with English resume using the following link: