Senior Product Engineer

vor 1 Monat

Dresden, Sachsen, Deutschland Infineon Technologies AG Vollzeit

About the Role

The Senior Front End Product Engineer will join Infineon's External Wafer Manufacturing, Technology, Quality and Transfer Management (EWM TQTM) BCD/RF team, where they will be responsible for front-end product engineering topics related to outsourcing BCD/RF products, including NVM memory products. The ideal candidate will have in-depth knowledge of product engineering, devices, and processes, as well as experience resolving technical issues with external wafer foundries.

Key Responsibilities

  • Lot assessment and disposition after wafer probing test and yield deviation analysis of production.
  • Set up wafer stop limit (SBL and yield limit) for wafer probing test bins and define the scrap limit with Infineon internal team.
  • Front End wafer probing yield monitoring and yield roadmap setup of BCD/RF products running in outsourcing wafer foundry.
  • Co-work with Infineon EWM process integration and quality experts to improve processes to reduce production costs and increase yields for production.
  • Be interface of wafer foundry and testing house, focal point for front-end process issues, low yield investigation & test parametric data analysis, support wafer probing yield assessments towards foundry process change and CIP/DOE lots as well as testing issue reduction for production.
  • Co-work with internal technical team and external wafer foundry for root cause understanding of customer returns and final test failures of production.
  • Work closely with the Infineon design team, product development team and test development team to solve yield problems before production(NPI stage).
  • Support product release milestones and release both wafer probing testprogram and products from NPI stage to production as frond end product engineer role.
  • Interface with internal and external customers to resolve technical issues requiring in-depth product knowledge.
  • Support wafer probing and final test specification alignment with Infineon internal experts.

Requirements

  • Min. Bachelor/Master Degree in Electronic Engineering or equivalent.
  • Min. 4~7 years of working experience in Product Engineering, Test Engineering, or Device Engineering in the semiconductor field.
  • In-depth knowledge of BCD/RF/NVM products and processes.
  • Knowledge of device fabrication process, such as Diff/IMP/CMP/Litho/Etch/CVD/PVD etc., including inline and electrical testing PCM items and their impact on device performance.
  • Theoretical and practical knowledge of PN junction diodes, Schottky diodes, BJT, MOSFETs, capacitors, and resistors, etc.
  • Good statistical knowledge (SPC).
  • Experience with Mentor/Galaxy Examinator/ACE/PDF Exensio and JMP data analysis tools and Python/Tableau knowledge is desired.
  • Excellent interpersonal, verbal, and written communication skills.
  • Ability to demonstrate great attention to detail.
  • Team player and self-motivated.

About Infineon Technologies AG

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

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