Process Technician I-Process
vor 3 Wochen
Are you looking for a unique opportunity to be part of a dynamic team that works on cutting-edge technology? At Microchip Technology, we offer a collaborative atmosphere of trust, empowerment, respect, diversity, and communication. Our company is built by dedicated team players who love to challenge the status quo, and we take pride in our commitment to employee development, values-based decision making, and strong sense of community.
We are seeking a skilled Process Technician I-Process to join our Process Engineering team. As a key member of our team, you will be responsible for the processes of wire-bonding as well as die-bonding of Surface Acoustic Wave (SAW) based filters and oscillators. You will need to have the willingness to act on your own authority to support the production and to optimize and further develop your processes.
This position will expose you to a wide variety of process engineering challenges related to backend manufacturing technologies for Surface Acoustic Wave filters and oscillators with a focus on Al-wire-bonding and die-bonding technologies. You will be involved in supporting the Process Engineering team in the field of maintenance, process control and analysis as well as the development of new packaging technologies.
Responsibilities:
- Responsibility for the processes of Al-wire-bonding and die-bonding of SAW packages.
- Contribution to the requirements of new and optimized equipment and material specifications and related tooling.
- Support of the Process Engineering team and the production regarding yield improvement, process development and optimization, as well as failure analysis.
- Strong technical interest and skills to maintain and repair manufacturing equipment and to increasingly take over responsibilities for processes.
- Willingness and ability to collaborate with other relevant departments to ensure high productivity in Process Engineering.
Requirements:
- Completed vocational training as an Electronics Technician for Automation Technology.
- Experience in wire-bonding technology.
Competencies:
- Experience in backend manufacturing technologies.
- Good technical and electronical understanding to support the manufacturing equipment.
- Good German language skills in speaking and writing; effective English language skills to communicate with suppliers and comprehend technical literature.
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