Field Applications Engineer Intern

vor 2 Monaten

Garching bei München, Bayern, Deutschland Texas Instruments Vollzeit
Unlock Your Potential as a Field Applications Engineer Intern

We're shaping the future of electronics, and we want you to be a part of it. As a Field Applications Engineer Intern at Texas Instruments, you'll have the opportunity to develop your technical skills and expertise in a dynamic and innovative environment.

Key Responsibilities:
  • Conduct research on power architectures and industry trends for motor drives
  • Explore TI's hardware portfolio with a focus on motor drives applications
  • Create and understand block diagrams based on customer applications
  • Document your results in a presentable way to discuss the application with the customer
  • Gain hands-on experience in the daily job of a Field Applications Engineer focusing on industrial applications
Requirements:
  • Student of Electrical Engineering, Electronics Technology, Electrical Engineering Technology, or related field
  • Fluent in German and English, both written and oral communication skills
  • Basic understanding of semiconductors, electrical systems, schematics, and analog components
  • Knowledge and understanding of analog circuitry (examples include: op-amps, DC/DC power, data converters, sensing, etc.)
  • Passionate about solving technical challenges and enjoy having technical conversations with external and internal counterparts
Why TI?

We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. We value diversity, innovation, and teamwork, and we're committed to making a positive impact on the world.

As a global semiconductor company, we design, manufacture, test, and sell analog and embedded processing chips to nearly 100,000 customers. Our products enable electronics everywhere and in things you experience every day - from healthcare, smart homes, and connected cars to drones, smartphones, and more.

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