Backside Metallization Equipment Specialist

vor 3 Wochen


Munich, Bayern, Deutschland Bertrandt Vollzeit
Job Description

We are seeking a highly skilled Backside Metallization Equipment Specialist to join our team at Bertrandt. As a key member of our semiconductor manufacturing team, you will be responsible for leading the technical evaluation and selection of backside metallization modules and equipment.

Key Responsibilities:
  • Lead and coordinate the introduction, integration, commissioning, fine-tuning, and maintenance of backside metallization modules and relevant equipment.
  • Establish and manage a team structure for backside metallization equipment, imparting skills and increasing competitiveness in equipment technology.
  • Prepare key technologies and build expertise in core equipment technology.
  • Handle equipment upgrades, modifications, or replacements with second sources to improve overall competence in terms of efficiency, stability, and throughput.
Requirements:
  • Successfully completed studies in electrical engineering, mechanical engineering, physics, or a comparable field within the semiconductor industry.
  • At least 12 years of experience in the introduction or development of backside metallization equipment for semiconductors.
  • Practical experience in the introduction or production of SiC products in fabs is required.
  • Good knowledge of backside metallization equipment in semiconductor manufacturing, including grinding, sawing, laser scribing, laser marking, chip handling, backside cleaning, and backside annealing.
  • Ability to independently carry out conversions and improvements on equipment and conduct analyses and develop solutions for deviations in online machines and products.
What We Offer:
  • Responsible tasks and flexible working hours.
  • Networking throughout the group.
  • Attractive compensation and team-oriented work.


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