Expert - SiC Substrate Cutting & Polishing Process Specialist

Vor 3 Tagen


Munich, Bayern, Deutschland European Tech Recruit Vollzeit

Job Opportunity: Expert - SiC Substrate Cutting & Polishing Process Specialist

European Tech Recruit


We are seeking an experienced Expert - SiC Substrate Cutting & Polishing Process Specialist to join our team at a Global Leading Tech company based in Bavaria, Germany.


The ideal candidate will have a strong background in semiconductor substrate cutting & polishing introduction or development, with a minimum of 10+ years of experience in the field. Fab experience in SiC product introduction or production is a must.


Key Responsibilities:

  • Develop and execute SiC substrate cutting & polishing process development and project execution related work.
  • Lead the development of the manufacturing process flow of SiC power components related to substrate cutting & polishing process modules.
  • Ensure smooth manufacturing during ramp-up, pre-production & production phases.


Requirements:

  • Bachelor's degree or above in semiconductor physics, microelectronics, materials, chemistry or similar discipline within the semiconductor industry.
  • 10+ years of experience working on semiconductor substrate cutting & polishing introduction or development. Fab experience in SiC product introduction or production is a must.
  • Familiarity with SiC process flow, manufacturing process & characterization techniques preferred.
  • Semiconductor material processing, preferably for power devices development.


What We Offer:

  • A challenging and rewarding role in a dynamic and innovative company.
  • Opportunities for professional growth and development.
  • A competitive salary and benefits package.


How to Apply:

Please submit your CV and a cover letter to European Tech Recruit for consideration.



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