Expert - SiC Substrate Cutting & Polishing Process Specialist
Vor 3 Tagen
Job Opportunity: Expert - SiC Substrate Cutting & Polishing Process Specialist
European Tech Recruit
We are seeking an experienced Expert - SiC Substrate Cutting & Polishing Process Specialist to join our team at a Global Leading Tech company based in Bavaria, Germany.
The ideal candidate will have a strong background in semiconductor substrate cutting & polishing introduction or development, with a minimum of 10+ years of experience in the field. Fab experience in SiC product introduction or production is a must.
Key Responsibilities:
- Develop and execute SiC substrate cutting & polishing process development and project execution related work.
- Lead the development of the manufacturing process flow of SiC power components related to substrate cutting & polishing process modules.
- Ensure smooth manufacturing during ramp-up, pre-production & production phases.
Requirements:
- Bachelor's degree or above in semiconductor physics, microelectronics, materials, chemistry or similar discipline within the semiconductor industry.
- 10+ years of experience working on semiconductor substrate cutting & polishing introduction or development. Fab experience in SiC product introduction or production is a must.
- Familiarity with SiC process flow, manufacturing process & characterization techniques preferred.
- Semiconductor material processing, preferably for power devices development.
What We Offer:
- A challenging and rewarding role in a dynamic and innovative company.
- Opportunities for professional growth and development.
- A competitive salary and benefits package.
How to Apply:
Please submit your CV and a cover letter to European Tech Recruit for consideration.
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