Power Module Simulation Design Expert

vor 4 Wochen

Munich, Deutschland 理想汽车 Vollzeit

Job Responsibilities:

  • Responsible for the development of power module electromagnetic and circuit models include Spice model, optimizing power module electrical design, chip selection, and solving difficult problems such as oscillation, current sharing, crosstalk, and circulation current;
  • Responsible for the thermal resistance simulation, flow resistance simulation and various working condition temperature simulations of the power module, and optimizing the thermal design of the power module, completing the development of the electrothermal coupling simulation model of the power module;
  • Leading the power module packaging process simulation such as warpage, thermal mechanical stress, mold flow simulation, optimizing power module design, tooling fixture solution and key process parameters;
  • Aim to find root cause for power module reliability issues using simulation method, and complete lifetime assessment model and DFR for power modules;
  • Leading the continuous optimization of the power module simulation platform, defining a fast, robust, and automated simulation workflow, improving model accuracy based on experimental results, and realizing product virtual design and digital engineering;
  • Responsible for tracking cutting-edge simulation theories and methods for power modules, and using AI and big data methods to accelerate power module design and process development.

Job Requirements:

  • Bachelor degree or above, majoring in Material science, Microelectronics, Mechanical engineering, Electrical engineering, Power electronics or other related fields.
  • Above 10 years’ experience in power semiconductor product development, and at least 5 years of experience in power module thermal simulation, stress & reliability simulation, electrical simulation and mold flow simulation;
  • Possess a solid theoretical foundation for the microstructure, basic working principles, common failure modes and power electronic circuits of power semiconductor devices such as Si, SiC and GaN;
  • Familiar with the power module packaging structure, electrothermal characteristics, packaging process (including welding process, bonding process, silver sintering process, mold transfer process, etc.) as well as dynamic, static and reliability testing methods and standards;
  • Proficiency in using ANSYS HFSS/Maxwell/Q3D/PSpice/LTSpice/Comsol/FloEFD/Fluent/ANSYS mechanical/Moldex3D and Minitab/MATLAB/PYTHON for data processing and result analysis ;
  • Must have excellent negotiation and problem-solving skills，proactive and creative;
  • Proficient English communication and writing skills, excellent team coordination and communication skills.

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